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The news of Fluke Process Instruments GmbH

Temperature profiling and analysis solutions for reflow applications – Datapaq at enova exhibition in Paris

juillet 24, 2014

Cambridge, UK – At the 2014 enova exhibition in Paris, Datapaq (stand K41) will present temperature profiling solutions for all kinds of reflow soldering processes, including wave, vapor phase, and selective soldering as well as reworking. Based on robust data loggers and application-specific thermal barriers, Reflow Tracker systems pass through SMT processes along with the printed circuit boards, compiling detailed temperature profiles and, if required, providing data for real-time monitoring via radio. The systems help reduce reject rates and increase yield. The accompanying Easy Oven Setup (EOS) software automatically determines the optimal oven recipe for specific products or manufacturing equipment, rendering consecutive test runs unnecessary and thereby saving considerable time and effort.

Temperature profiling and analysis solutions for reflow applications – Datapaq at enova exhibition in Paris
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Datapaq releases Insight version 7.3 Real-time data export via OPC and enhanced usability

mars 25, 2014

Datapaq releases its Insight Software version 7.3 with enhanced features for temperature profiling and analysis in all kinds of industrial heating processes. Insight now supports the real-time export of data via OPC (“Open Platform Communications”). OPC is an industrial automation standard that allows communication between a data source (the OPC server) and a software application (the OPC client). The data may include process data and records of alarms and events. With Insight acting as an OPC server, data can be passed directly from the logger to a user's own preferred OPC-client process-management application, thereby assisting with live process control and enhancing productivity. The software update furthermore introduces user-friendly tools to the industry-specific Food Insight and Oven Insight versions that support process optimization, helping users set up heating and cooling processes and adapt parameters without repeated trial runs.

Datapaq releases Insight version 7.3 Real-time data export via OPC and enhanced usability
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In-process temperature profiling in the solar industry: New solution for profiling vacuum ovens and furnaces

mars 25, 2014

Datapaq provides the first ever temperature profiling system designed specifically for use in hot vacuum processes. Measuring accurate product temperatures in these processes has always been a challenge as the airlocks and seals prevent the use of trailing thermocouples. The Datapaq in-process profiler passes through the process chambers along with the product being measured. It uses short thermocouples to take measurements directly from the product at all stages of the process. Thus, users can check uniformity of heating at every stage of the process and optimize the process settings to improve both product quality and production yields. Up to six thermocouples are attached to the Q18 data logger which records detailed temperature profiles. The logger is protected from the heat of the furnace by a revolutionary low-height reflective-plate technology thermal barrier (type VB7400) that has been designed to ensure there is no outgassing. As a consequence of this, profiling can be conducted regularly with minimal process disruption. The system is completed by the comprehensive Insight analysis software. This easy to use software translates the temperature readings into meaningful information quickly, clearly and easily, enabling the engineers to focus on optimizing the process.

In-process temperature profiling in the solar industry: New solution for profiling vacuum ovens and furnaces
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New Insight Survey software compliant with AMS 2750E

février 17, 2014

Datapaq provides a certified temperature monitoring system for the civil and military aviation industry and suppliers who need to prove furnace compliance with AMS 2750E. The dedicated Insight Survey software has been updated according to revision E. New features make surveys and reports easy as never before. A wizard supports data logger setup. Parameters can be saved for future surveys. An overshoot alarm and three selectable alerts are available for stability calculation. The updated software applies rounding according to ASTM E29 to fully comply with revision E. Data traceability is guaranteed. The new Insight Survey version enables complete AMS 2750E documentation – just one click generates a full report. In accordance with security requirements, access is password-protected. The hottest and coldest points are highlighted on the display and in the report. The time between the first and last thermocouple entering the lower tolerance band is calculated automatically. The integrated function for area under curve calculation eliminates the need to export the data to a spreadsheet. Users can define longer intervals and shorter reports to facilitate analysis and archiving. Reports can be exported as PDF files for easy sharing.

New Insight Survey software compliant with AMS 2750E
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NADCAP AMS 2750 compliant temperature monitoring for aerospace furnace surveys

février 17, 2014

Manufacturers of ceramic molds for aerospace superalloys have to conduct regular furnace surveys to verify that reheat furnaces comply with the NADCAP AMS 2750 specification. Requirements for temperature sensors and analysis systems are also laid down by the industry standard. Datapaq is one of the few providers of temperature monitoring solutions who can ensure AMS 2750E compliance. The company has designed a dedicated solution for reheat furnaces that provides exact, real-time temperature data from inside the process. A high-temperature barrier protects a Tpaq21 data logger with an internal radio transmitter. The customized thermal barrier is suitable for repeated use in the furnace surveys which take up to eight hours and reach maximum temperatures of 1,250 °C. The accompanying software generates AMS 2750E compliant process reports. The Datapaq solution enables energy savings through the optimization of furnace parameters. Maintenance efforts and downtimes are also reduced.

NADCAP AMS 2750 compliant temperature monitoring for aerospace furnace surveys
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