New miniature cooling aggregates for the LAM 6 series
octobre 20, 2023
Heat sinks
Concepts for the heat dissipation of electronic devices and components receive an enormous increase in efficiency through the use of fan-assisted designs, so-called cooling aggregates. However, the effectiveness of these aggregates for forced convection is only maximised if the geometry and surface of the heat exchange areas are matched to the fan being used and its performance in terms of air volume and pressure. For this purpose Fischer Elektronik is expanding its existing product range of miniature cooling aggregates with the LAM 6 D and LAM 6 D K designs. The new designs have dimensions of 60 x 120 mm and are available for transistor screw mounting or clip mounting. The profile cross-sections consist of an extrusion profile formed as a tube with cooling fins on the inside of each side surface. The fins absorb the heat emitted by the device and dissipate it to the inner air of the enclosed channel structure. The powerful axial fans circulate air through the fin channel and ensure very efficient device deheating. The new LAM 6 D and LAM 6 D K miniature cooling aggregates are optionally available with fan voltages of 12 V, 24 V and 48 V.
The miniature cooling aggregate LAM 6 D K contains a special groove geometry in the lateral semiconductor mounting surfaces, whereby the component can be fastened securely and quickly with the help of so-called snap-in transistor retaining springs. The different snap-in transistor retaining springs THFU 1-7 have been developed for the transistor types TO 218, TO 220, TO 247, TO 264 and various SIP-Multiwatt as well as hole-less power transistors. After installation of the snap-in transistor retaining spring, the spring holds immovably in its position and fixes the transistor on the mounting surface with high contact pressure. Additional mechanical CNC machining, modifications or special designs and surfaces are realised according to customer specifications.
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