CYBERSURF 3D: Automatic and manual semiconductor process control

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Presentation

The ultimate solution for fully automated control on silicon wafer.

Features:

- Automatic wafer load / unload
- 6'' and 8'' wafers, 12'' on request
- Auto alignment
- Automatic measurement sequence :
. Bump dimensions
. Roughness (grinding, local stress)
. Step height
. Film thickness (photoresist, oxide,...)
- Custom report format :
. Chip per chip statistics
. Wafer per wafer statistics
. Temporal evolution of process parameters over several months

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