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The PDR IR-E6 SMT/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
The station is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
The IR-E6 is well specified yet can be easily configured to your exact requirements, with a good range of advanced features to choose from, allowing the operator to quickly and safely rework all types of components without overheating the component, adjacents or the PCB. It uses all the proven attributes of PDR’s Focused IR technology, first introduced in 1987 and now used worldwide by over 4000 customers.
BGA rework poses the problem of accessing hidden interconnects in a high density environment. Consequently, it requires a station that is able to access the hidden joints without affecting neighbouring components. A station that is safe, gentle, adaptable and, above all, simple to operate. The IR-E6 is such a station. It is so easy to operate that technicians are able to instantly achieve excellent process control for BGA/SMT rework without the complexities and frustrations normally associated with ‘high-end’ rework stations.
With the aid of excellent mechanics, optics and control, operators can simply pick up the fluxed BGA from the nest, align it, place it onto the PCB’s pads and then reflow with the station’s accurate PC based, closedloop component and PCB temperature control.
150W, lens based Focused IR heating with adjustable image system.3200W, two zone (500mm x 270mm heating area).Advanced Professional vacuum placement system.Integrated nest with flux dip tray or component print frame.Advanced Professional PCB table with macro-micro X/Y.Standard non-contact IR temperature sensor.Software based auto profile thermal control.Split beam prism system for simultaneous PCB/component viewing.Auxiliary process observation camera.Highly effective, integral PCB cooling with air knife system.