Design Analysis Solutions - Moldflow Plastics Insight™ (MPI)

Moldflow's analysis products can simulate plastics flow and packing, mold cooling, and part shrinkage and warpage for thermoplastic injection molding, gas-assisted injection molding, co-injection molding and injection-compression molding processes. Additional modules simulate reactive molding processes including thermoset and rubber injection molding, reaction injection molding (RIM), structural reaction injection molding (SRIM), resin transfer molding, microchip encapsulation and Underfill (flip-chip) encapsulation.

Moldflow's MPI technology can be used on all CAD model geometry types, including traditional midplane models, wire frame and surface models, thin-walled solids and thick or difficult-to-midplane solids. Regardless of your design geometry, you can accomplish simulation tasks in an easy-to-use, consistent, integrated environment that works with your model.