Phenolic epoxy : Hempaprime CUI 275

Hempaprime CUI 275 is a phenolic epoxy improvement based on fast drying, alkylamine cured epoxy. It provides long lasting barrier protection in coating systems for severe corrosive environments, including high temperature and wet conditions found beneath thermal insulation.

It can be used across a wide temperature range where corrosion under insulation (CUI) typically occurs and where thermal cycling is present. It can be specified for operating temperatures from -196°C (-321°F) to 204°C (400°F), with sporadic allowance up to 275°C (527°F). The product significantly reduces the risk of cracking when applied at high DFTs compared to traditional epoxy phenolic coatings. It can be used in new construction and maintenance and repair, on carbon and stainless steels, and for both insulated and uninsulated service.